Bambu Lab Support for PLA - White
Bambu Lab Support for PLA is a specially designed breakaway support that works with almost any type of PLA. It supports the build material when printing objects with features such as bridges or overhangs and must be printed in the Bambu Lab AMS (Automatic Material System) or printers with dual extruders. Bambu Support for PLA bonds weakly to the PLA by acting as an interface, allowing it to be easily and cleanly removed by hand or tool, with no need for post-processing. Its ease of use and compatibility makes removing the support much easier and less frustrating.
Eco-friendly
Bambu Lab spool have 20% less plastic waste.
RFID for Smart Printing
All print parameters are embedded in RFID that can be read by Bambu Lab AMS (Automatic Material System).
Load and print, No more tedious adjustments!
Please contact us for more details about Bambu Lab PLA and 3D Printer!
| Diameter |
1.75 mm |
| Net Filament Weight |
0.5 kg |
| Spool Material |
PC + ABS (Temperature resistance 90 ̊C) |
| Spool Size |
Diameter: 200 mm; Height: 67mm |
| Drying Settings before Printing |
55 ̊C, 8 hours |
| Printing and Storage Humidity |
< 20% RH (Sealed with desiccant) |
| Nozzle Temperature |
220 - 230 ̊C |
| Bed Type |
Cool Plate, High Temperature Plate or Textured PEI Plate |
| Bed Surface Preparation |
PVP Glue |
| Cooling Fan |
100 % |
| Printing Speed |
< 200 mm/s |
| Retraction Length |
0.6 - 1.0 mm |
| Retraction Speed |
20 - 40 mm/s |
| Chamber Temperature |
25 - 45 ̊C |
| Bed Temperature |
35 -45 ̊C |
Physical Properties
| Density |
1.22 g/cm³ |
| Vicat Softening Temperature |
N / A |
| Heat Deflection Temperature |
N / A |
| Melting Temperature |
190 ̊C |
| Melt Index |
6.4 ± 1.2 g/10 min |
Mechanical Properties
| Tensile Strength |
N / A |
| Breaking Elongation Rate |
N / A |
| Bending Modulus |
N / A |
| Bending Strength |
N / A |
| Imapct Strength |
N / A |